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HBM3 Memory

Next-Generation High-Bandwidth Memory Technology

Performance

9.6 Gbps

Peak Speed (HBM3E)

Capacity

Up to 36GB

Per Stack

Bandwidth

1.28 TB/s

Maximum

HBM3/HBM3E Modules (13)
Part NumberManufacturerGenerationCapacitySpeedBandwidthGPU Compatible
KHBA84A03D-MC1HSamsungHBM324GB6.4 Gbps819 GB/s
AMDAMD+3
KHBA84A03C-MC1HSamsungHBM324GB6.4 Gbps819 GB/s
AMDAMD+3
KHBA84A03C-MC1HTSamsungHBM324GB6.4 Gbps819 GB/s
-
KHBAC4A03C-MC1HTSamsungHBM324GB6.4 Gbps819 GB/s
-
KHBAC4A03D-MC1HSamsungHBM324GB6.4 Gbps819 GB/s
AMDAMD+3
KHBB84A03B-MC1JSamsungHBM3E24GB8.6 Gbps1100 GB/s
AMDAMD+2
KHBBC4B03C-MC1KSamsungHBM3E36GB9.2 Gbps1280 GB/s
AMDAMD+2
H3HBM3-16GB-8HiSK HynixHBM316GB6 Gbps768 GB/s
AMDAMD+3
H3HBM3-24GB-12HiSK HynixHBM324GB6.4 Gbps819 GB/s
AMDAMD+3
H3EHBM3E-24GB-8HiSK HynixHBM3E24GB9 Gbps1150 GB/s
AMDAMD+2
H3EHBM3E-36GB-12HiSK HynixHBM3E36GB9.6 Gbps1230 GB/s
AMDAMD+2
MT65B18G16120A00QH-92-AMicronHBM3E24GB9.2 Gbps1200 GB/s
AMDAMD+2
MT65BHBM3E-36GB-12HiMicronHBM3E36GB9.2 Gbps1200 GB/s
AMDAMD+2
Primary Use Cases

AI & Machine Learning

LLM training, inference, and fine-tuning

High-Performance Computing

Scientific simulations and data analytics

Data Centers

Enterprise GPU acceleration

Key Advantages

Extreme Bandwidth

Up to 1.28 TB/s vs 100 GB/s for DDR5

Compact Form Factor

Stacked die technology in small package

GPU-Optimized

Designed for NVIDIA & AMD accelerators

GPU Compatibility Matrix
NVIDIA H10011 modules
SamsungSamsungSamsung+8
NVIDIA H20011 modules
SamsungSamsungSamsung+8
AMD MI30011 modules
SamsungSamsungSamsung+8
AMD MI300X11 modules
SamsungSamsungSamsung+8
NVIDIA GH2005 modules
SamsungSamsungSamsung+2