What is a DDR memory cross-reference?

A DDR memory cross-reference allows you to find equivalent memory modules from different manufacturers. For example, if you have a Samsung DDR4 8GB RDIMM, you can find the equivalent Micron or SK Hynix module with matching specifications (type, density, speed, voltage, ranks, ECC).

How do I find an equivalent memory module for Samsung, Micron, or SK Hynix?

Use MemoryXRef to search by part number (e.g., M393A1G40DB0-CPB) or by specification (e.g., DDR4 RDIMM 8GB 3200). The tool instantly shows equivalent modules from all manufacturers including Samsung, Micron, SK Hynix, Kingston, Corsair, Apacer, ADATA, and Innodisk.

What memory types does MemoryXRef support?

MemoryXRef supports DDR3, DDR4, and DDR5 memory modules in all form factors: RDIMM (Registered DIMM), SODIMM (Small Outline DIMM), UDIMM (Unbuffered DIMM), and LRDIMM (Load-Reduced DIMM). The database covers both ECC and non-ECC modules.

Which memory manufacturers are covered?

MemoryXRef covers 17 manufacturers: Samsung, Micron, SK Hynix, Kingston, Corsair, Crucial, G.Skill, Intelligent Memory, SMART Modular, Apacer, ADATA, Innodisk, Transcend, PNY, Team Group, Patriot, and KLEVV. The database contains 3,491 memory modules with full cross-references.

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CXL Memory Expanders

Cross-reference CXL memory expansion modules from Samsung, SK Hynix, and Micron for AI servers, HPC, and data centers

8 Products3 ManufacturersCXL 2.0Up to 24TB pooled6 in Production

CXL (Compute Express Link) memory modules represent the next evolution in server memory architecture. Unlike traditional DIMMs that connect directly to CPU memory channels, CXL memory expanders plug into PCIe Gen5 slots (E3.S form factor) and extend memory capacity and bandwidth beyond what DIMM slots allow. CXL enables memory pooling — multiple servers sharing a common memory pool — and memory disaggregation — scaling memory independently from compute. These modules are critical for AI training, large language model inference, in-memory databases, and HPC workloads where memory capacity is the bottleneck.

Peak Bandwidth

60 GB/s

Samsung CMM-B (rack appliance)

Max Capacity

24TB

Samsung CMM-B pooled

Interface

PCIe Gen5

E3.S form factor

CXL Memory Products

SamsungProductionCXL 2.0

Samsung CMM-D MD220 128GB

MXFAH1280MB0-CCP

Capacity

128GB

Bandwidth

36 GB/s

Interface

PCIe Gen5 x8

Form Factor

E3.S (EDSFF)

SamsungProductionCXL 2.0

Samsung CMM-D MD220 256GB

MXFAH2560MB0-CCP

Capacity

256GB

Bandwidth

36 GB/s

Interface

PCIe Gen5 x8

Form Factor

E3.S (EDSFF)

SamsungProductionCXL 2.0

Samsung CMM-D 512GB

MXFAH5120MB0-CCP

Capacity

512GB

Bandwidth

36 GB/s

Interface

PCIe Gen5 x8

Form Factor

E3.S (EDSFF)

SamsungProductionCXL 1.1 / 2.0Appliance

Samsung CMM-B Memory Pooling Box

Capacity

Up to 24TB

Bandwidth

60 GB/s

Interface

PCIe Gen5

Form Factor

Rack appliance (2U)

SK HynixSamplingCXL 2.0

SK Hynix CMM-DDR5 96GB

Capacity

96GB

Bandwidth

~36 GB/s

Interface

PCIe 5.0 x8

Form Factor

E3.S (EDSFF)

SK HynixAnnouncedCXL 2.0+

SK Hynix CMM-Ax (CXL Memory-Accelerator)

Capacity

TBD

Bandwidth

TBD

Interface

PCIe 5.0

Form Factor

E3.S / Custom

MicronProductionCXL 2.0

Micron CXL 2.0 Memory Expansion 96GB

Capacity

96GB

Bandwidth

~36 GB/s

Interface

PCIe Gen5 x8

Form Factor

E3.S (EDSFF)

MicronProductionCXL 2.0System

Micron H3 Falcon System

Capacity

Scalable (disaggregated)

Bandwidth

Scalable

Interface

PCIe Gen5

Form Factor

Rack-level system

Cross-Reference Matrix

Competing modules grouped by capacity tier. Use this to find equivalent products across manufacturers.

96GB Tier

Entry-level CXL expansion — 3 competing products

Manufacturer	Product	Part Number	Capacity	Status	Notes
Samsung	CMM-D MD220 128GB	MXFAH1280MB0-CCP	128GB	Production	Nearest Samsung equivalent (128GB vs 96GB)
SK Hynix	CMM-DDR5 96GB	—	96GB	Sampling	Montage controller, 1a nm
Micron	CXL 2.0 96GB	—	96GB	Production	Astera Labs Leo controller

256GB Tier

High-capacity single module — Samsung only

Manufacturer	Product	Part Number	Capacity	Status	Notes
Samsung	CMM-D MD220 256GB	MXFAH2560MB0-CCP	256GB	Production	Only option at this capacity
SK Hynix	—	—	N/A	Announced	No equivalent announced
Micron	—	—	N/A	Announced	No equivalent announced

512GB Tier

Maximum single-module capacity — Samsung only

Manufacturer	Product	Part Number	Capacity	Status	Notes
Samsung	CMM-D 512GB	MXFAH5120MB0-CCP	512GB	Production	3DS stacked DRAM
SK Hynix	—	—	N/A	Announced	No equivalent
Micron	—	—	N/A	Announced	No equivalent

Rack-Scale Tier

Memory pooling appliances for multi-host environments

Manufacturer	Product	Part Number	Capacity	Status	Notes
Samsung	CMM-B Pooling Box	—	Up to 24TB	Production	Up to 8 hosts, Supermicro certified
SK Hynix	—	—	N/A	Announced	CMM-Ax (compute, not pooling)
Micron	H3 Falcon System	—	Scalable	Production	20× graph DB perf, Linux FAMFS

CXL Technology Glossary

Key terms for understanding CXL memory architecture and products.

CXL

Compute Express Link — open standard high-speed interconnect built on PCIe physical layer, enabling cache-coherent communication between CPUs and memory/accelerators.

CMM-D

CXL Memory Module-DRAM (Samsung naming) — a CXL Type 3 device that provides DRAM-based memory expansion via PCIe Gen5 E3.S slot.

CMM-B

CXL Memory Module-Box (Samsung naming) — a rack appliance that houses multiple CMM-D modules and enables memory pooling across up to 8 servers.

CMM-Ax

CXL Memory Module-Accelerator (SK Hynix naming) — adds near-memory compute capabilities to CXL memory, enabling processing-in-memory for AI workloads.

E3.S

EDSFF Enterprise and Datacenter Standard Form Factor — the physical slot used by CXL memory modules, the same slot as enterprise NVMe SSDs (formerly known as Ruler SSD).

CXL 1.1

First widely deployed CXL specification. Supports single-host attachment. Enables memory expansion but not pooling or switching.

CXL 2.0

Adds memory pooling, CXL switching, and multi-host support. Enables multiple servers to share a common CXL memory pool with dynamic allocation.

CXL 3.0

Adds multi-level switching, fabric capabilities, and enhanced peer-to-peer communication. Expected to reach broad deployment in 2026–2027.

Memory Pooling

Multiple hosts sharing a common pool of CXL-attached memory, with capacity dynamically allocated per workload demand. Reduces stranded memory across servers.

Memory Disaggregation

Decoupling memory from compute, allowing memory capacity to scale independently from CPU/server count. Enables right-sizing of memory per workload.

NUMA

Non-Uniform Memory Access — CXL memory appears as additional NUMA nodes to the operating system, with slightly higher latency than local DRAM (~596 ns vs ~80 ns).

Type 3 Device

CXL device classification for pure memory expansion (no compute, just memory). All CXL memory expanders (CMM-D, Micron 96GB) are Type 3 devices.